UMC Stories

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Intel reveals chip advances, new partnerships & foundry progress

Intel advances chip tech with new process nodes, packaging options, and partnerships, boosting foundry services and US-based production.

By Catherine Knowles • 4 min read • Wed, 30th Apr 2025

Siemens

Siemens launches Calibre 3DThermal for advanced thermal analysis

Siemens Digital Industries Software has launched Calibre 3DThermal, a cutting-edge tool for thermal analysis and debugging in 3D integrated circuits, enhancing design reliability.

By Kaleah Salmon • 3 min read • Wed, 26th Jun 2024

Network Infrastructure

Intel & UMC announce collaboration on 12nm process platform

Intel and global semiconductor foundry, UMC, reveal partnership to create a 12-nanometer semiconductor process platform, diversifying supply chains and expanding sourcing options for clients.

By Sean Mitchell • 2 min read • Mon, 29th Jan 2024

UMC Stories

Global Stories

Intel reveals chip advances, new partnerships & foundry progress

Siemens launches Calibre 3DThermal for advanced thermal analysis

Intel & UMC announce collaboration on 12nm process platform

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